飛思卡爾加入IBM半導體研發(fā)技術聯(lián)盟
Freescale Joins IBM Technology Alliance for Semiconductor Research
飛思卡爾加入IBM半導體研發(fā)技術聯(lián)盟
January 24, 2007 -- Freescale Semiconductor and IBM announced that Freescale will join the IBM technology alliance for joint semiconductor research and development. The agreement includes Complementary Metal Oxide Semiconductor (CMOS) and Silicon-on-Insulator (SOI) technologies as well as advanced semiconductor research and design enablement transitioning at the 45-nanometer generation. Freescale is the first technology development partner in the IBM technology alliance to participate in both low-power and high-performance technology research and development.
2007年1月24日消息——飛思卡爾半導體公司和IBM宣布飛思卡爾將加入IBM半導體研發(fā)技術聯(lián)盟。該協(xié)議包括互補金屬氧化物半導體(CMOS)以及絕緣硅片(SOI)技術以及轉向45納米級別高端半導體的研究和設計。飛思卡爾是首家參與IBM技術聯(lián)盟低功耗、高性能技術研發(fā)的技術開發(fā)合作伙伴。
This agreement brings together Freescale's leadership in key embedded markets, including automotive, networking, wireless, industrial and consumer, with IBM's success in developing world-class technology and industry-leading systems expertise.
這個協(xié)議將飛思卡爾在主要嵌入式市場，包括汽車、網(wǎng)絡、無線、工業(yè)和消費市場的領導地位，與IBM在開發(fā)世界級技術的成功以及業(yè)界領先的系統(tǒng)專家技術結合了在一起。
This alliance will enable Freescale to further strengthen its manufacturing strategy. In addition to leveraging owned capacity in internal fabs and its existing relationships with leading foundry manufacturers, Freescale will have access to the combined manufacturing capacity of IBM's Common Platform partners. The Common Platform provides its semiconductor fabrication partners with synchronized manufacturing processes to help ensure the maximum flexibility and lowest development investment for multi-source, high volume manufacturing.
該聯(lián)盟將使得飛思卡爾進一步加強其生產(chǎn)策略。除了調衡自有工廠的產(chǎn)能以及與現(xiàn)有領先的鑄造廠商合作之外，飛思卡爾還將加入IBM倡導的“共同平臺“合作伙伴的綜合生產(chǎn)能力。該“共同平臺”為其半導體制作合作伙伴提供同步的生產(chǎn)過程，幫助確保多源、高容量生產(chǎn)獲得最大限度的機動性和最低的開發(fā)投資。
"This partnership creates an exciting opportunity to combine the complementary strengths of Freescale and the IBM Alliance," said Sumit Sadana, senior vice president, Strategy and Business Development and acting chief technology officer, Freescale. "This industry-leading technology roadmap will enable Freescale to deliver substantial value to our customers."
飛思卡爾代理首席技術官兼戰(zhàn)略和業(yè)務發(fā)展部高級副總裁Sumit Sadana表示：“這次合作為飛思卡爾和IBM聯(lián)盟的實力互補創(chuàng)造了一個極好機會。這一業(yè)界領先的技術路標將使飛思卡爾為客戶帶來巨大的價值。”
"Freescale's addition to the IBM technology alliance is a significant vote of confidence for IBM's collaborative model and the work we are doing jointly with our technology partners," said Lisa Su, vice president, Semiconductor Research and Development, IBM. "Freescale will be a valuable addition to our team, with its deep expertise in semiconductor process development and fast growing embedded applications, like automotive, networking and wireless."
IBM半導體研發(fā)部副總裁 Lisa Su則表示：“飛思卡爾加入IBM聯(lián)盟是對IBM的合作模式以及我們聯(lián)合技術合作伙伴正在開展的工作投的一張重要信任票。通過其在半導體過程開發(fā)的深厚技術能力，以及在汽車、網(wǎng)絡和無線等飛速增長的嵌入式應用，飛思卡爾將成為我們團隊很有價值的一個補充。”
About Freescale Semiconductor
關于飛思卡爾半導體
Freescale Semiconductor, Inc. is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial, networking and wireless markets. The privately held company is based in Austin, Texas, and has design, research and development, manufacturing or sales operations in more than 30 countries. Freescale is one of the world's largest semiconductor companies with sales of $6.2 billion (USD) for the most recently reported four quarters.
飛思卡爾半導體公司是一家為汽車、消費、工業(yè)、網(wǎng)絡和無線市場設計和生產(chǎn)嵌入式半導體的全球領導者。私屬的飛思卡爾總部位于德克薩斯州奧斯汀，在全球30多個國家擁有設計、研發(fā)、生產(chǎn)和銷售業(yè)務。飛思卡爾是世界上最大的半導體公司之一，最近四個季度的報道銷售額是62億美元。
飛思卡爾加入IBM半導體研發(fā)技術聯(lián)盟
January 24, 2007 -- Freescale Semiconductor and IBM announced that Freescale will join the IBM technology alliance for joint semiconductor research and development. The agreement includes Complementary Metal Oxide Semiconductor (CMOS) and Silicon-on-Insulator (SOI) technologies as well as advanced semiconductor research and design enablement transitioning at the 45-nanometer generation. Freescale is the first technology development partner in the IBM technology alliance to participate in both low-power and high-performance technology research and development.
2007年1月24日消息——飛思卡爾半導體公司和IBM宣布飛思卡爾將加入IBM半導體研發(fā)技術聯(lián)盟。該協(xié)議包括互補金屬氧化物半導體(CMOS)以及絕緣硅片(SOI)技術以及轉向45納米級別高端半導體的研究和設計。飛思卡爾是首家參與IBM技術聯(lián)盟低功耗、高性能技術研發(fā)的技術開發(fā)合作伙伴。
This agreement brings together Freescale's leadership in key embedded markets, including automotive, networking, wireless, industrial and consumer, with IBM's success in developing world-class technology and industry-leading systems expertise.
這個協(xié)議將飛思卡爾在主要嵌入式市場，包括汽車、網(wǎng)絡、無線、工業(yè)和消費市場的領導地位，與IBM在開發(fā)世界級技術的成功以及業(yè)界領先的系統(tǒng)專家技術結合了在一起。
This alliance will enable Freescale to further strengthen its manufacturing strategy. In addition to leveraging owned capacity in internal fabs and its existing relationships with leading foundry manufacturers, Freescale will have access to the combined manufacturing capacity of IBM's Common Platform partners. The Common Platform provides its semiconductor fabrication partners with synchronized manufacturing processes to help ensure the maximum flexibility and lowest development investment for multi-source, high volume manufacturing.
該聯(lián)盟將使得飛思卡爾進一步加強其生產(chǎn)策略。除了調衡自有工廠的產(chǎn)能以及與現(xiàn)有領先的鑄造廠商合作之外，飛思卡爾還將加入IBM倡導的“共同平臺“合作伙伴的綜合生產(chǎn)能力。該“共同平臺”為其半導體制作合作伙伴提供同步的生產(chǎn)過程，幫助確保多源、高容量生產(chǎn)獲得最大限度的機動性和最低的開發(fā)投資。
"This partnership creates an exciting opportunity to combine the complementary strengths of Freescale and the IBM Alliance," said Sumit Sadana, senior vice president, Strategy and Business Development and acting chief technology officer, Freescale. "This industry-leading technology roadmap will enable Freescale to deliver substantial value to our customers."
飛思卡爾代理首席技術官兼戰(zhàn)略和業(yè)務發(fā)展部高級副總裁Sumit Sadana表示：“這次合作為飛思卡爾和IBM聯(lián)盟的實力互補創(chuàng)造了一個極好機會。這一業(yè)界領先的技術路標將使飛思卡爾為客戶帶來巨大的價值。”
"Freescale's addition to the IBM technology alliance is a significant vote of confidence for IBM's collaborative model and the work we are doing jointly with our technology partners," said Lisa Su, vice president, Semiconductor Research and Development, IBM. "Freescale will be a valuable addition to our team, with its deep expertise in semiconductor process development and fast growing embedded applications, like automotive, networking and wireless."
IBM半導體研發(fā)部副總裁 Lisa Su則表示：“飛思卡爾加入IBM聯(lián)盟是對IBM的合作模式以及我們聯(lián)合技術合作伙伴正在開展的工作投的一張重要信任票。通過其在半導體過程開發(fā)的深厚技術能力，以及在汽車、網(wǎng)絡和無線等飛速增長的嵌入式應用，飛思卡爾將成為我們團隊很有價值的一個補充。”
About Freescale Semiconductor
關于飛思卡爾半導體
Freescale Semiconductor, Inc. is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial, networking and wireless markets. The privately held company is based in Austin, Texas, and has design, research and development, manufacturing or sales operations in more than 30 countries. Freescale is one of the world's largest semiconductor companies with sales of $6.2 billion (USD) for the most recently reported four quarters.
飛思卡爾半導體公司是一家為汽車、消費、工業(yè)、網(wǎng)絡和無線市場設計和生產(chǎn)嵌入式半導體的全球領導者。私屬的飛思卡爾總部位于德克薩斯州奧斯汀，在全球30多個國家擁有設計、研發(fā)、生產(chǎn)和銷售業(yè)務。飛思卡爾是世界上最大的半導體公司之一，最近四個季度的報道銷售額是62億美元。
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